UAV Propulsion Tech AMT Netherlands Advanced Micro Turbines 230N (51.7lbf) to 1569N (532LBF) thrust JetA1/JP5/JP8/Diesel Target/cUAS/UAV High reliability Low fuel burn Available in the USA from: UAV PROPULSION TECH +1 (810 441-1457 [email protected] www.uavpropulsiontech.com Tooling up Using chiplets means designing the system in various ways and the same package may hold different chiplets, providing varying levels of embedded performance. New automated tools are enabling engineers to explore the best options for vehicle design as the options are so wide now. For the next generation of electrical and electronic controllers, systems are grouped by physical location with central compute in a zonal architecture, but there are scalability challenges. There is a gap in compute performance between the low end at 100 TOPS and the high end of 1000 TOPS, and from 100 Gb/s to 1000 Gb/s in memory bandwidth. A low-end design starts with a chiplet for the interfaces, or the IO chiplet. This is a monolithic die that can also handle minimal processing for low-end applications as a fusion chip that controls cameras and displays. For more performance there is a computing extension. Automated driving systems can add an ADAS chiplet to handle more cameras and sensors. This leads on to nine system options that need new tools to explore the design space. Instead of designing nine separate chips, the tool can define three chiplets for five architectures for each segment with four packaging options: two for standalone, low-cost platforms, I/O + Compute; and four of the ADAS chiplets. These variants have been tested in a simulator called VPSim as virtual prototypes for benchmarking, which has a good trade-off between speed and accuracy, but this is not good enough for the chiplets. The design flow includes automated exploration of the design space, so that from just the parameters, candidate devices can be identified and the key performance indicators (KPIs) extracted to generate the binaries for the virtual models to perform the benchmarks. FPGAs Processors and GPUs are not the only way of providing the embedded compute capability for uncrewed systems. While chiplets can provide some additional standard functions, sometimes that is not enough and custom logic is needed. Field-programmable gate arrays (FPGAs) combine an array of reconfigurable logic with a hardware processor subsystem and high-speed interfaces. While previous generation FPGA devices have used chiplets to integrate interfaces built on a different process technology from the main array fabric, these interfaces are now being combined in monolithic devices to provide more performance in a smaller size. The latest pure automotive FPGA slims down the packaging to 9 x 9 mm from the previous 19 x 19 mm, with 81,000 cells for configurable logic and 3.8 Mbits of memory. This comes from moving to a 16 nm process that Embedded computing tech | Focus We don’t just manufacture parts. We Build Relationships DECAVO 489 North 8th Street, Hood River, Oregon 97031 541.716.0100 decavo.com Decavo specializes in state-of-the-art composite design and fabrication. We’re here to meet your business needs, from initial concept to full production. Primary Capabilities Trim and Machining • Precision multi-axis trim and machining • Vertically integrated tooling • Metallics/Composites/Additive • Lean high mix — low volume systems • Tight tolerance abilities Composite Lamination • Bladder molding • Compression molding • Out of autoclave • Trapped polymer molding Paint • Specialty coatings • Mil-spec compliant • EMI shielding • Vapor deposition • Class A finishes Applications Primary structures • Wings • Fuel tanks • Landing gear • Fuselages Specialty structures • EMI enclosures • Radomes • Custom electronic enclosures • Rotor blades Proudly manufactured in
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